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  december 2009 doc id 12733 rev 3 1/33 1 TDA7563B 4 x 50w multifunction quad power amplifier with built-in diagnostics feature features multipower bcd technology mosfet output power stage dmos power output new high efficiency (class sb) high output power capability 4 x 28 w/4 @ 14.4 v, 1 khz 10% thd, 4 x 50 w max, power max. output power 4 x 72 w /2 full i 2 c bus driving: ? standby ? independent front/rear soft play/mute ? selectable gain 30 db /16 db (for low noise line output function) ? high efficiency enable/disable ?i 2 c bus digital diagnostics (including dc bus ac load detection) full fault protection dc offset detection four independent short circuit protection clipping detector pin with selectable threshold (2 % / 10 %) standby/mute pin linear thermal shutdown with multiple thermal warning esd protection description the TDA7563B is a new bcd technology quad bridge type of car radio amplifier in flexiwatt27 package specially intended for car radio applications. thanks to the dmos output stage the TDA7563B has a very low distortion allowing a clear powerful sound. among the features, its superior efficiency performance coming from the internal exclusive structure, makes it the most suitable device to simplify the thermal management in high power sets. the dissipated output power under average listening condition is in fact reduced up to 50 % when compared to the level provided by conventional class ab solutions. this device is equipped with a full diagnostics array that communicates the status of each speaker through the i 2 c bus. flexiwatt27 powerso36 flexiwatt27 (horizontal) (vertical) (slug up) table 1. device summary order code package packing TDA7563B flexiwatt27 (vertical) tube TDA7563Bh flexiwatt27 (horizontal) tube TDA7563Bpd powerso36 tube TDA7563Bpdtr powerso36 tape and reel www.st.com
contents TDA7563B 2/33 doc id 12733 rev 3 contents 1 block diagram and application cir cuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.4 electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 diagnostics functional desc ription . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.1 turn-on diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.2 permanent diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.3 output dc offset detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.4 ac diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5 multiple faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.1 faults availability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6 thermal protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 6.1 fast muting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7i 2 c bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.1 i 2 c programming/reading sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.2 i2c bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.2.1 data validity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.2.2 start and stop conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.2.3 byte format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.2.4 acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 8 software specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 9 examples of bytes sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
TDA7563B contents doc id 12733 rev 3 3/33 10 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
list of tables TDA7563B 4/33 doc id 12733 rev 3 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 3. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 4. electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 5. double fault table for turn on diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 6. ib1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 7. ib2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 8. db1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 9. db2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 table 10. db3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 table 11. db4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 12. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
TDA7563B list of figures doc id 12733 rev 3 5/33 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 2. application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 3. pins connection diagram of the flexiwatt27 (top of view). . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 4. pins connection diagram of the powerso36 slug up (top of view) . . . . . . . . . . . . . . . . . . . . 7 figure 5. quiescent current vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 6. output power vs. supply voltage (4w) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 figure 7. output power vs. supply voltage (2w) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 figure 8. distortion vs. output power (4w, std) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 figure 9. distortion vs. output power (4 , hi-eff) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 10. distortion vs. output power (2 , std) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 11. distortion vs. frequency (4w) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 12. distortion vs. frequency (2w) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 13. crosstalk vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 14. supply voltage rejection vs. freq. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 15. power dissipation and efficiency vs. output power (4w, std, sine) . . . . . . . . . . . . . . . . . 13 figure 16. power dissipation and efficiency vs. output power (4w, hi-eff, sine). . . . . . . . . . . . . . . 13 figure 17. power dissipation vs. average output power (audio program simulation, 4w) . . . . . . . . . . 13 figure 18. power dissipation vs. average output power (audio program simulation, 2w) . . . . . . . . . . 13 figure 19. turn-on diagnostic: working principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 20. svr and output behavior (case 1: without turn-on diagnostic) . . . . . . . . . . . . . . . . . . . . . 14 figure 21. svr and output pin behavior (case 2: with turn-on diagnostic) . . . . . . . . . . . . . . . . . . . . . 15 figure 22. short circuit detection thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 23. load detection thresholds - high gain setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 24. load detection threshold - low gain setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 figure 25. restart timing without diagnostic enable (permanent) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 26. restart timing with diagnostic enable (permanent). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 27. current detection: load impedance |z| vs. output peak voltage . . . . . . . . . . . . . . . . . . . . . 18 figure 28. thermal foldback diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 29. data validity on the i2c bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 figure 30. timing diagram on the i2c bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 figure 31. acknowledge on the i2c bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 figure 32. flexiwatt27 (horizontal) mechanical data and package dimensions. . . . . . . . . . . . . . . . . . 29 figure 33. flexiwatt27 (vertical) mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . 30 figure 34. powerso36 (slug up) mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . 31
block diagram and application circuit TDA7563B 6/33 doc id 12733 rev 3 1 block diagram and application circuit figure 1. block diagram figure 2. application circuit short circuit protection & diagnostic i2cbus mute1 mute2 thermal protection & dump clip detector in lf in rr in rf in lr vcc1 vcc2 cd_out out rf+ out rf- out rr+ out rr- out lf+ out lf- out lr+ out lr- short circuit protection & diagnostic short circuit protection & diagnostic short circuit protection & diagnostic 16/30db reference clk data svr ac_gnd tab s_gnd pw_gnd f f r r rf rr lf lr st-by/mute 16/30db 16/30db 16/30db in rf c1 0.22 f in rr c2 0.22 f out rf out rr in lf c3 0.22 f in lr c4 0.22 f out lf out lr d00au1231a c5 1 f c6 10 f tab 47k - + - + - + - + vcc1 vcc2 c8 0.1 f v(4v .. v cc ) c7 3300 f data i 2 c bus clk 13 12 15 16 23 26 2 14 s-gnd 17 11 5 cd out v 721 18 19 20 22 25 24 10 9 8 6 3 4 1, 27
TDA7563B pins description doc id 12733 rev 3 7/33 2 pins description figure 3. pins connection diagram of the flexiwatt27 (top of view) figure 4. pins connection diagram of the powerso36 slug up (top of view) d00au1230mo d tab stby pw_gnd lr out lr- cd-out out lr+ v cc1 out lf- pw_gnd lf out lf+ svr in lf in lr s_gnd in rr in rf ac gnd out rf+ pw_gnd rf out rf- v cc2 ck out rr- out rr+ pw_gnd rr data adsel/i2cdis 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 25 26 22 21 23 24 27 d00au141 6 tab stby pw_gnd lr out lr- cd-out out lr+ v cc1 out lf- pw_gnd lf out lf+ svr in lf in lr s_gnd in rr in rf ac gnd out rf+ pw_gnd rf out rf- v cc2 ck out rr- out rr+ pw_gnd rr data tab 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 25 26 22 21 23 24 27 flexiwatt27 (vertical) flexiwatt27 (horizontal) cd n.c. n.c. out2+ pwgnd out4+ n.c. n.c. ck out3- n.c. n.c. out3+ pwgnd pwgnd n.c. out1- vcc 18 16 17 15 6 5 4 3 2 21 22 31 32 33 35 34 36 20 1 19 tab vcc d04au1547a out4- vcc data acgnd in4 in3 9 8 7 28 29 30 out2- sgnd 10 27 n.c. stby vcc in2 out1+ in1 14 12 11 23 25 26 pwgnd svr 13 24
electrical specifications TDA7563B 8/33 doc id 12733 rev 3 3 electrical specifications 3.1 absolute maximum ratings 3.2 thermal data 3.3 electrical characteristics refer to the test circuit, v s = 14.4 v; r l = 4 ; f = 1 khz; g v = 30 db; t amb = 25 c; unless otherwise specified. table 2. absolute maximum ratings symbol parameter value unit v op operating supply voltage 18 v v s dc supply voltage 28 v v peak peak supply voltage (for t = 50ms) 50 v v ck ck pin voltage 6 v v data data pin voltage 6 v i o output peak current (not repetitive t = 100ms) 8 a i o output peak current (repetitive f > 10hz) 6 a p tot power dissipation t case = 70c 85 w t stg , t j storage and junction temperature -55 to 150 c table 3. thermal data symbol parameter powerso flexiwatt unit r th j-case thermal resistance junction-to-case max. 11c/w table 4. electrical characteristics symbol parameter test condition min. typ. max. unit power amplifier v s supply voltage range - 8 - 18 v i d total quiescent drain current - - 170 300 ma p o output power max. power (v s = 15.2 v, square wave input (2vrms)) -50-w thd = 10% thd = 1% 25 20 28 22 -w
TDA7563B electrical specifications doc id 12733 rev 3 9/33 p o output power r l = 2 ; eiaj (v s = 13.7 v) r l = 2 ; thd 10 % r l = 2 ; thd 1 % r l = 2 ; max power 55 40 32 60 68 50 40 75 -w thd total harmonic distortion p o = 1 w to 10 w; std mode he mode; p o = 1.5 w he mode; p o = 8 w - 0.03 0.02 0.15 0.1 0.1 0.5 % p o = 1-10 w, f = 10 khz - 0.2 0.5 % g v = 16d b; std mode v o = 0.1 to 5 v rms - 0.02 0.05 % c t cross talk f = 1 khz to 10 khz, r g = 600 50 60 - db r in input impedance - 60 100 130 k g v1 voltage gain 1 - 29.5 30 30.5 db g v1 voltage gain match 1 - -1 - 1 db g v2 voltage gain 2 - 15.5 16 16.5 db g v2 voltage gain match 2 - -1 - 1 db e in1 output noise voltage 1 r g = 600 20 hz to 22 khz - 50 100 v e in2 output noise voltage 2 r g = 600 ; g v = 16 db 20 hz to 22 khz -1530v svr supply voltage rejection f = 100 hz to 10 khz; v r = 1 vpk; r g = 600 50 60 - db bw power bandwidth - 100 - - khz a sb standby attenuation - 90 110 - db i sb standby current v st-by = 0 - 1 10 a a m mute attenuation - 80 100 - db v os offset voltage mute and play -100 0 100 mv v am min. supply mute threshold - 7 7.5 8 v t on turn on delay d2/d1 (ib1) 0 to 1 - 5 20 ms t off turn off delay d2/d1 (ib1) 1 to 0 - 5 20 ms v sby standby/mute pin for st-by - 0 - 1.5 v v mu standby/mute pin for mute - 3.5 - 5 v cmrr input cmrr v cm = 1 vpk-pk; rg = 0 -55-db v op standby/mute pin for operating - 7 - v s v i mu standby/mute pin current v st-by/mute = 8.5 v - 20 40 a v st-by/mute < 1.5 v - 0 5 a cd lk clip det high leakage current cd off / v cd = 6 v - 0 5 a cd sat clip det sat. voltage cd on; i cd = 1 ma - - 300 mv table 4. electrical characteristics (continued) symbol parameter test condition min. typ. max. unit
electrical specifications TDA7563B 10/33 doc id 12733 rev 3 cd thd clip det thd level d0 (ib1) = 1 5 10 15 % d0 (ib1) = 0 1 2 3 % turn on diagnostics 1 (power amplifier mode) pgnd short to gnd det. (below this limit, the output is considered in short circuit to gnd) power amplifier in standby --1.2v pvs short to vs det. (above this limit, the output is considered in short circuit to vs) vs -1.2 - - v pnop normal operation thresholds. (within these limits, the output is considered without faults). 1.8 - vs -1.8 v lsc shorted load det. - - 0.5 lop open load det. 130 - lnop normal load det. 1.5 - 70 turn on diagnostics 2 (line driver mode) pgnd short to gnd det. (below this limit, the output is considered in short circuit to gnd) power amplifier in standby --1.2v pvs short to vs det. (above this limit, the output is considered in short circuit to vs) vs -1.2 - - v pnop normal operation thresholds. (within these limits, the output is considered without faults). 1.8 - vs -1.8 v lsc shorted load det. - - 1.5 lop open load det. 400 - lnop normal load det. 4.5 - 200 permanent diagnostics 2 (power amp lifier mode or line driver mode) pgnd short to gnd det. (below this limit, the output is considered in short circuit to gnd) power amplifier in mute or play, one or more short circuits protection activated --1.2v pvs short to vs det. (above this limit, the output is considered in short circuit to vs) vs -1.2 - - v pnop normal operation thresholds. (within these limits, the output is considered without faults). 1.8 - vs -1.8 v l sc shorted load det. power amplifier mode - - 0.5 line driver mode - - 1.5 table 4. electrical characteristics (continued) symbol parameter test condition min. typ. max. unit
TDA7563B electrical specifications doc id 12733 rev 3 11/33 3.4 electrical characteristics curves v o offset detection power amplifier in play, ac input signals = 0 1.5 2 2.5 v i nl normal load current detection v o < (v s -5)pk 500 - - ma i ol open load current detection - - 250 ma i 2 c bus interface s cl clock frequency - - - 400 khz v il input low voltage - - - 1.5 v v ih input high voltage - 2.3 - - v figure 5. quiescent current vs. supply voltag e figure 6. output power vs. supply voltage (4 ) figure 7. output power vs. supply voltage (2 ) figure 8. distortion vs. output power (4 , std) table 4. electrical characteristics (continued) symbol parameter test condition min. typ. max. unit 8 1012141618 vs (v) 70 90 110 130 150 170 190 210 230 250 id (ma) vin = 0 no loads vs ( v ) 8 9 10 11 12 13 14 15 16 17 18 5 10 15 20 25 30 35 40 45 50 55 60 65 70 po (w) rl = 4 ohm f = 1 khz thd = 10 % po-max thd = 1 % 8 9 10 11 12 13 14 15 16 vs ( v ) 10 20 30 40 50 60 70 80 90 100 po (w) rl = 2 ohm f = 1 khz thd = 10 % po-max thd = 1 % 0.1 1 10 po ( w ) 0.01 0.1 1 10 thd (%) f = 10 khz standard mode vs = 14.4 v rl = 4 ohm f = 1 khz
electrical specifications TDA7563B 12/33 doc id 12733 rev 3 figure 9. distortion vs. output power (4 , hi- eff) figure 10. distortion vs. output power (2 , std) figure 11. distortion vs. frequency (4 ) figure 12. distortion vs. frequency (2 ) figure 13. crosstalk vs. frequency figure 14. supply voltage rejection vs. freq. 0.1 1 10 po ( w ) 0.001 0.01 0.1 1 10 thd (%) f = 10 khz hi-eff mode vs = 14.4 v rl = 4 ohm f = 1 khz 0.1 1 10 po ( w ) 0.01 0.1 1 10 thd (%) f = 10 khz hi-eff mode vs = 14.4 v rl = 2 ohm f = 1 khz 10 100 1000 10000 f ( hz ) 0.01 0.1 1 10 thd (%) standard mode vs = 14.4 v rl = 4 ohm po = 4 w 10 100 1000 10000 f ( hz ) 0.01 0.1 1 10 thd (%) standard mode vs = 14.4 v rl = 2 ohm po = 4 w 10 100 1000 10000 f ( hz ) 20 30 40 50 60 70 80 90 crosstalk (db) standard mode rl = 4 ohm po = 4 w rg = 600 ohm 10 100 1000 10000 f ( hz ) 20 30 40 50 60 70 80 90 svr (db) std & he mode rg = 600 ohm vripple = 1 vpk
TDA7563B electrical specifications doc id 12733 rev 3 13/33 figure 15. power dissipation and efficiency vs. output power (4 , std, sine) figure 16. power dissipation and efficiency vs. output power (4w, hi-eff, sine) figure 17. power dissipation vs. average output power (audio program simulation, 4 ) figure 18. power dissipation vs. average output power (audio program simulation, 2 ) 0 2 4 6 8 1012141618202224262830 po ( w ) 0 10 20 30 40 50 60 70 80 90 ptot (w) 0 10 20 30 40 50 60 70 80 90 n (%) ptot standard mode vs = 14.4 v rl = 4 x 4 ohm f = 1 khz sine n po ( w ) 0.1 1 10 0 10 20 30 40 50 60 70 80 90 ptot (w) 0 10 20 30 40 50 60 70 80 90 n (%) n ptot hi-eff mode vs = 14.4 v rl = 4 x 4 ohm f = 1 khz sine 012345 po ( w ) 0 5 10 15 20 25 30 35 40 45 ptot (w) vs = 14 v rl = 4 x 4 ohm gaussian noise std mode hi-eff mode clip start 0123456789 po ( w ) 0 10 20 30 40 50 60 70 80 90 ptot (w) vs = 14 v rl = 4 x 2 ohm gaussian noise std mode hi-eff mode clip start
diagnostics functional description TDA7563B 14/33 doc id 12733 rev 3 4 diagnostics functional description 4.1 turn-on diagnostic it is activated at the turn-on (standby out) under i 2 c bus request. detectable output faults are: short to gnd short to vs short across the speaker open speaker to verify if any of the above misconnections are in place, a subsonic (inaudible) current pulse ( figure 19 ) is internally generated, sent through the speaker(s) and sunk back. the turn on diagnostic status is internally stored until a successive diagnostic pulse is requested (after a i 2 c reading). if the "standby out" and "diag. enable" commands are both given through a single programming step, the pulse takes place firs t (power stage still in standby mode, low, outputs= high impedance). afterwards, when the amplifier is biased, the permanent diagnostic takes place. the previous turn on state is kept until a short appears at the outputs. figure 19. turn-on diagnostic: working principle figure 20 and 21 show svr and output waveforms at the turn-on (standby out) with and without turn-on diagnostic. figure 20. svr and output behavior (case 1: without turn-on diagnostic) ch- ch+ isource vs~5v isink t (ms) i (ma) isink isource ~100ms measure time bias (power amp turn-on) t diagnostic enable (permanent) permanent diagnostic acquisition time (100ms typ) permanent diagnostics data (output) permitted time i2cb data vsvr out fault event read data
TDA7563B diagnostics functional description doc id 12733 rev 3 15/33 figure 21. svr and output pin behavior (case 2: with turn-on diagnostic) the information related to the outputs status is read and memorized at the end of the current pulse top. the acquisition time is 100 ms (typ.). no audible noise is generated in the process. as for short to gnd / vs the fault-detection thresholds remain unchanged from 30 db to 16 db gain setting. they are as follows: figure 22. short circuit detection thresholds concerning short across the speaker / open speaker, the threshold varies from 30 db to 16 db gain setting, since different loads are expected (either normal speaker's impedance or high impedance). the values in case of 30 db gain are as follows: figure 23. load detection thresholds - high gain setting if the line-driver mode (gv= 16 db and line driver mode diagnostic = 1) is selected, the same thresholds will change as follows: figure 24. load detection threshold - low gain setting bias (power amp turn-on) permitted time turn-on diagnostic acquisition time (100ms typ) t read data permanent diagnostic acquisition time (100ms typ) permanent diagnostics data (output) permitted time diagnostic enable (turn-on) turn-on diagnostics data (output) permitted time i2cb data vsvr out diagnostic enable (permanent) fault event d01au1253 s.c. to gnd x s.c. to vs 0v 1.8v v s -1.8v v s x normal operation 1.2v v s -1.2v s.c. across load x open load 0v 1.5 70 infinite x normal operation 0.5 130 d01au1254 d01au1252mod s.c. across load x open load 0 7 180 infinite x normal operation 1.5 330
diagnostics functional description TDA7563B 16/33 doc id 12733 rev 3 4.2 permanent diagnostics detectable conventional faults are: ? short to gnd ?short to vs ? short across the speaker the following additional features are provided: ? output offset detection the TDA7563B has 2 operating statuses: 1. restart mode. the diagnostic is not enabled. each audio channel operates independently from each other. if any of the a.m. faults occurs, only the channel(s) interested is shut down. a check of the output status is made every 1 ms ( figure 25 ). restart takes place when the overload is removed. 2. diagnostic mode. it is enabled via i 2 c bus and self activates if an output overload (such to cause the intervention of the short-circuit protection) occurs to the speakers outputs. once activated, the diagnostics procedure develops as follows ( figure 26 ): ? to avoid momentary re-circulation spikes from giving erroneous diagnostics, a check of the output status is made after 1ms: if normal situation (no overloads) is detected, the diagnostic is not performed and the channel returns back active. ? instead, if an overload is detected during the check after 1 ms, then a diagnostic cycle having a duration of about 100 ms is started. ? after a diagnostic cycle, the audio channel interested by the fault is switched to restart mode. the relevant data are stored inside the device and can be read by the microprocessor. when one cycle has term inated, the next one is activated by an i 2 c reading. this is to ensure continuous diagnostics throughout the car-radio operating time. ? to check the status of the device a sampling system is needed. the timing is chosen at microprocessor level (over half a second is recommended). figure 25. restart timing without diagnostic enable (permanent) - each 1ms time, a sampling of the fault is done figure 26. restart timing with diagnostic enable (permanent) t 1-2ms 1ms 1ms 1ms 1ms overcurrent and short circuit protection intervention (i.e. short circuit to gnd) short circuit removed out t overcurrent and short circuit protection intervention (i.e. short circuit to gnd) short circuit removed 1-2ms 100/200ms 1ms 1ms
TDA7563B diagnostics functional description doc id 12733 rev 3 17/33 4.3 output dc offset detection any dc output offset exceeding 2 v are signalled out. this inconvenient might occur as a consequence of initially defective or aged and worn-out input capacitors feeding a dc component to the inputs, so putting the speakers at risk of overheating. this diagnostic has to be performed with low-level output ac signal (or vin = 0). the test is run with selectable time duration by microprocessor (from a "start" to a "stop" command): ? start = last reading operation or setting ib1 - d5 - (offset enable) to 1 ? stop = actual reading operation excess offset is signalled out if persistent th roughout the assigned testing time. this feature is disabled if any overloads leading to activati on of the short-circuit protection occurs in the process. 4.4 ac diagnostic it is targeted at detecting accidental disconnection of tweeters in 2-way speaker and, more in general, presence of capacitively (ac) coupled loads. this diagnostic is based on the notion that the overall speaker's impedance (woofer + parallel tweeter) will tend to increase towards high frequen cies if the tweeter gets disconnected, because the remaining speaker (woofer) would be out of its operating range (high impedance). the diagnostic decision is made according to peak output current thresholds, as follows: iout > 500 mapk = normal status iout < 250 mapk = open tweeter to correctly implement this feature, it is nece ssary to briefly provide a signal tone (with the amplifier in "play") whose frequency and magnitude are such to determine an output current higher than 500 mapk with in normal conditions and lower than 250 mapk should the parallel tweeter be missing. the test has to last for a minimum number of 3 sine cycles starting from the activation of the ac diagnostic function ib2 < d2 > 0 up to the i 2 c reading of the results (measuring period). to confirm presence of tweeter, it is necessary to find at least 3 current pulses over 500 ma over all the measuring period, else an "open tweeter" message will be issued. the frequency / magnitude setting of the test tone depends on the impedance characteristics of each specific speaker being used, with or without the tweeter connected (to be calculated case by case). high-frequency tones (> 10 khz) or even ultrasonic signals are recommended for their negligible acoustic impact and also to maximize the impedance module's ratio between with tweeter-on and tweeter-off. figure 27 shows the load impedance as a function of the peak output voltage and the relevant diagnostic fields. this feature is disabled if any overloads leading to activation of the short-circuit protection occurs in the process.
diagnostics functional description TDA7563B 18/33 doc id 12733 rev 3 figure 27. current detection: load impedance |z| vs. output peak voltage 12345678 1 2 3 5 10 20 30 50 vout (peak) load |z| (ohm) iout (peak) <250ma iout (peak) >500ma low current detection area (open load) d5 = 1 of the dbx byres high current detection area (normal load) d5 = 0 of the dbx bytes
TDA7563B multiple faults doc id 12733 rev 3 19/33 5 multiple faults when more misconnections are simultaneously in place at the audio outputs, it is guaranteed that at least one of them is initially read out. the others are notified after successive cycles of i 2 c reading and faults removal, provided that the diagnostic is enabled. this is true for both kinds of diagnostic (turn on and permanent). the table below shows all the couples of double-fault possible. it should be taken into account that a short circuit with the 4 ohm speaker unconnected is considered as double fault. s. gnd (so) / s. gnd (sk) in the above table make a distinction according to which of the 2 outputs is shorted to ground (test-current source side= so, test-current sink side = sk). more precisely, in channels lf and rr, so = ch+, sk = ch-; in channels lr and rf, so = ch-, sk = ch+. in permanent diagnostic the table is the same, with only a difference concerning open load (*), which is not among the recognizable faults. should an open load be present during the device's normal working, it would be detected at a subsequent turn on diagnostic cycle (i.e. at the successive car radio turn-on). 5.1 faults availability all the results coming from i 2 c bus, by read operations, are the consequence of measurements inside a defined period of time. if the fault is stable throughout the whole period, it will be sent out. to guarantee always resident functions, every ki nd of diagnostic cycles (turn-on, permanent, offset) will be reactivate after any i 2 c reading operation. so, when the micro reads the i 2 c, a new cycle will be able to start, but the read da ta will come from the previous diag. cycle (i.e. the device is in turn-on state, with a short to gnd, then the short is removed and micro reads i 2 c. the short to gnd is still present in bytes, because it is the result of the previous cycle. if another i 2 c reading operation occurs, the bytes do not show the short). in general to observe a change in diagnostic bytes, two i 2 c reading operations are necessary. table 5. double fault table for turn on diagnostic - s. gnd (so) s. gnd (sk) s. vs s. across l. open l. s. gnd (so) s. gnd s. gnd s. vs + s. gnd s. gnd s. gnd s. gnd (sk) / s. gnd s. vs s. gnd open l. (*) s. vs / / s. vs s. vs s. vs s. across l. / / / s. across l. n.a. open l. / / / / open l. (*)
thermal protection TDA7563B 20/33 doc id 12733 rev 3 6 thermal protection thermal protection is implemented through thermal foldback ( figure 28 ). thermal foldback begins limiting the audio input to the amplifier stage as the junction temperatures rise above the normal operating range. this effectively limits the output power capability of the device thus reducing the te mperature to acceptable levels without totally interrupting the operation of the device. the output power will decrease to the point at which ther mal equilibrium is reached. thermal equilibrium will be reached when the reduction in output power reduces the dissipated power such that the die temperature falls below the thermal foldback threshold. should the device cool, the audio level will in crease until a new thermal equilibrium is reached or the amplifier reaches full power. thermal foldback will reduce the audio output level in a linear manner. three thermal warning are available through the i 2 c bus data. figure 28. thermal foldback diagram 6.1 fast muting the muting time can be shortened to less than 1.5 ms by setting (ib2) d5 = 1. this option can be useful in transient battery situations (i.e. during car engine cranking) to quickly turnoff the amplifier for avoiding any audible effects caused by noise/transients being injected by preamp stages. the bit must be set back to ?0? shortly after the mute transition. tj ( c) th. sh. start th. sh. end vout th. warn. on tj ( c) vout tj ( c) sd (with same input signal) < t sd cd out th. warn. on th. warn. on 125 140 155 > t
TDA7563B i 2 c bus doc id 12733 rev 3 21/33 7 i 2 c bus 7.1 i 2 c programming/r eading sequences a correct turn on/off sequence respectful of the diagnostic timings and producing no audible noises could be as follows (after battery connection): ? turn-on: pin2 > 7 v --- 10 ms --- (s tandby out + diag enable) --- 500 ms (min) --- muting out ? turn-off: muting in --- 20 ms --- (diag disable + standby in) --- 10 ms - -- pin2 = 0 ? car radio installation: pin2 > 7v --- 10ms diag enable (write) --- 200 ms --- i 2 c read (repeat until all faults disappear). ? offset test: device in play (no si gnal) -- offset enable - 30 ms - i 2 c reading (repeat i 2 c reading until high-offset message disappears). 7.2 i 2 c bus interface data transmission from microprocessor to the TDA7563B and viceversa takes place through the 2 wires i 2 c bus interface, consisting of the two lines sda and scl (pull-up resistors to positive supply voltage must be connected). 7.2.1 data validity as shown by figure 29 , the data on the sda line must be stable during the high period of the clock. the high and low state of the data line can only change when the clock signal on the scl line is low. 7.2.2 start and stop conditions as shown by figure 30 a start condition is a high to low transition of the sda line while scl is high. the stop condition is a low to high transition of the sda line while scl is high. 7.2.3 byte format every byte transferred to the sda line must contain 8 bits. each byte must be followed by an acknowledge bit. the msb is transferred first.
i 2 c bus TDA7563B 22/33 doc id 12733 rev 3 7.2.4 acknowledge the transmitter* puts a resistive high level on the sda line during the acknowledge clock pulse (see figure 31 ). the receiver** the acknowledges has to pull-down (low) the sda line during the acknowledge clock pulse, so that the sda line is stable low during this clock pulse. * transmitter ?master ( p) when it writes an address to the TDA7563B ? slave (TDA7563B) when the p reads a data byte from TDA7563B ** receiver ? slave (TDA7563B) when the p writes an address to the TDA7563B ? master (p) when it reads a data byte from TDA7563B figure 29. data validity on the i 2 c bus figure 30. timing diagram on the i 2 c bus figure 31. acknowledge on the i 2 c bus sda scl data line stable, data valid change data allowed d99au1031 scl sda start i 2 cbus stop d99au1032 scl 1 msb 23789 sda start acknowledgment from receiver d99au1033
TDA7563B software specifications doc id 12733 rev 3 23/33 8 software specifications all the functions of the TDA7563B are activated by i 2 c interface. the bit 0 of the "address byte" defines if the next bytes are write instruction (from p to TDA7563B) or read instruction (from TDA7563B to p). chip address x = 0 write to device x = 1 read from device if r/w = 0, the p sends 2 "instruction bytes": ib1 and ib2. d7 d0 1101100xd8 hex table 6. ib1 bit instruction decoding bit d7 0 d6 diagnostic enable (d6 = 1) diagnostic defeat (d6 = 0) d5 offset detection enable (d5 = 1) offset detection defeat (d5 = 0) d4 front channel gain = 30 db (d4 = 0) gain = 16 db (d4 = 1) d3 rear channel gain = 30 db (d3 = 0) gain = 16 db (d3 = 1) d2 mute front channels (d2 = 0) unmute front channels (d2 = 1) d1 mute rear channels (d1 = 0) unmute rear channels (d1 = 1) d0 cd 2% (d0 = 0) cd 10% (d0 = 1)
software specifications TDA7563B 24/33 doc id 12733 rev 3 if r/w = 1, the TDA7563B sends 4 "diagnostics bytes" to p: db1, db2, db3 and db4. table 7. ib2 bit instruction decoding bit d7 0 d6 0 d5 normal muting time (d5 = 0) fast muting time (d5 = 1) d4 standby on - amplifier not working - (d4 = 0) standby off - amplifier working - (d4 = 1) d3 power amplifier mode diagnostic (d3 = 0) line driver mode diagnostic (d3 = 1) d2 current detection diagnostic enabled (d2 =1) current detection diagnostic defeat (d2 =0) d1 right channel power amplifier working in standard mode (d1 = 0) power amplifier working in high efficiency mode (d1 = 1) d0 left channel power amplifier working in standard mode (d0 = 0) power amplifier working in high efficiency mode (d0 = 1) table 8. db1 bit instruction decoding bit d7 thermal warning 1 active (d7 = 1), t j =155c d6 diag. cycle not activated or not terminated (d6 = 0) diag. cycle terminated (d6 = 1) d5 channel lf current detection output peak current < 250m a - output load (d5 = 1) output peak current > 500m a - output load (d5 = 0) d4 channel lf turn-on diagnostic (d4 = 0) permanent diagnostic (d4 = 1) d3 channel lf normal load (d3 = 0) short load (d3 = 1) d2 channel lf turn-on diag.: no open load (d2 = 0) open load detection (d2 = 1) offset diag.: no output offset (d2 = 0) output offset detection (d2 = 1) d1 channel lf no short to vcc (d1 = 0) short to vcc (d1 = 1) d0 channel lf no short to gnd (d1 = 0) short to gnd (d1 = 1)
TDA7563B software specifications doc id 12733 rev 3 25/33 table 9. db2 bit instruction decoding bit d7 offset detection not activated (d7 = 0) offset detection activated (d7 = 1) d6 x d5 channel lr current detection output peak current < 250m a - output load (d5 = 1) output peak current > 500m a - output load (d5 = 0) d4 channel lr turn-on diagnostic (d4 = 0) permanent diagnostic (d4 = 1) d3 channel lr normal load (d3 = 0) short load (d3 = 1) d2 channel lr turn-on diag.: no open load (d2 = 0) open load detection (d2 = 1) permanent diag.: no out put offset (d2 = 0) output offset detection (d2 = 1) d1 channel lr no short to vcc (d1 = 0) short to vcc (d1 = 1) d0 channel lr no short to gnd (d1 = 0) short to gnd (d1 = 1)
software specifications TDA7563B 26/33 doc id 12733 rev 3 table 10. db3 bit instruction decoding bit d7 standby status (= ib2 - d4) d6 diagnostic status (= ib1 - d6) d5 channel rf current detection output peak current <250ma - output load (d5 = 1) output peak current >500ma - output load (d5 = 0) d4 channel rf turn-on diagnostic (d4 = 0) permanent diagnostic (d4 = 1) d3 channel rf normal load (d3 = 0) short load (d3 = 1) d2 channel rf turn-on diag.: no open load (d2 = 0) open load detection (d2 = 1) permanent diag.: no out put offset (d2 = 0) output offset detection (d2 = 1) d1 channel rf no short to vcc (d1 = 0) short to vcc (d1 = 1) d0 channel rf no short to gnd (d1 = 0) short to gnd (d1 = 1)
TDA7563B software specifications doc id 12733 rev 3 27/33 table 11. db4 bit instruction decoding bit d7 thermal warning 2 active (d7 = 1), t j = 140c d6 thermal warning 3 active (d6 = 1) t j = 120c d5 channel rr current detection output peak current <250ma - output load (d5 = 1) output peak current >500ma - output load (d5 = 0) d4 channel rr turn-on diagnostic (d4 = 0) permanent diagnostic (d4 = 1) d3 channel r r normal load (d3 = 0) short load (d3 = 1) d2 channel rr turn-on diag.: no open load (d2 = 0) open load detection (d2 = 1) permanent diag.: no out put offset (d2 = 0) output offset detection (d2 = 1) d1 channel rr no short to vcc (d1 = 0) short to vcc (d1 = 1) d0 channel rr no short to gnd (d1 = 0) short to gnd (d1 = 1)
examples of bytes sequence TDA7563B 28/33 doc id 12733 rev 3 9 examples of bytes sequence 1 - turn-on diagnostic - write operation 2 - turn-on diagnostic - read operation the delay from 1 to 2 can be selected by software, starting from 1ms 3a - turn-on of the power amplifier with 30db gain, mute on, diagnostic defeat, cd = 2% . 3b - turn-off of the power amplifier 4 - offset detection procedure enable 5 - offset detection procedure stop and reading operation (the results are valid only for the offset detection bits (d2 of the bytes db1, db2, db3, db4) . the purpose of this test is to check if a d.c. offset (2v typ.) is present on the outputs, produced by input capacitor with anomalous leakage current or humidity between pins. the delay from 4 to 5 can be selected by software, starting from 1ms start address byte with d0 = 0 ack ib1 with d6 = 1 ack ib2 ack stop start address byte with d0 = 1 ack db1 ack db2 ack db3 ack db4 ack stop start address byte with d0 = 0 ack ib1 ack ib2 ack stop x0000000 xxx1xx11 start address byte with d0 = 0 ack ib1 ack ib2 ack stop x0xxxxxx xxx0xxxx start address byte with d0 = 0 ack ib1 ack ib2 ack stop xx1xx11x xxx1xxxx start address byte with d0 = 1 ack db1 ack db2 ack db3 ack db4 ack stop
TDA7563B package information doc id 12733 rev 3 29/33 10 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 32. flexiwatt27 (horizontal) mechanical data and package dimensions outline and mechanical data dim. mm inch min. typ. max. min. typ. max. a 4.45 4.50 4.65 0.175 0.177 0.183 b 1.80 1.90 2.00 0.070 0.074 0.079 c 1.40 0.055 d 2.00 0.079 e 0.37 0.39 0.42 0.014 0.015 0.016 f (1) 0.57 0.022 g 0.80 1.00 1.20 0.031 0.040 0.047 g1 25.75 26.00 26.25 1.014 1.023 1.033 h (2) 28.90 29.23 29.30 1.139 1.150 1.153 h1 17.00 0.669 h2 12.80 0.503 h3 0.80 0.031 l (2) 21.64 22.04 22.44 0.852 0.868 0.883 l1 10.15 10.5 10.85 0.40 0.413 0.427 l2 (2) 15.50 15.70 15.90 0.610 0.618 0.626 l3 7.70 7.85 7.95 0.303 0.309 0.313 l4 5 0.197 l5 5.15 5.45 5.85 0.203 0.214 0.23 l6 1.80 1.95 2.10 0.070 0.077 0.083 m 2.75 3.00 3.50 0.108 0.118 0.138 m1 4.73 0.186 m2 5.61 0.220 n 2.20 0.086 p 3.20 3.50 3.80 0.126 0.138 0.15 r 1.70 0.067 r1 0.50 0.02 r2 0.30 0.12 r3 1.25 0.049 r4 0.50 0.02 v5? (typ.) v1 3? (typ.) v2 20? (typ.) v3 45? (typ.) flexiwatt27 (horizontal) (1): dam-bar protusion not included; (2): molding protusion included 7399738 a
package information TDA7563B 30/33 doc id 12733 rev 3 figure 33. flexiwatt27 (vertical) mechanical data and package dimensions outline and mechanical data dim. mm inch min. typ. max. min. typ. max. a 4.45 4.50 4.65 0.175 0.177 0.183 b 1.80 1.90 2.00 0.070 0.074 0.079 c 1.40 0.055 d 0.75 0.90 1.05 0.029 0.035 0.041 e 0.37 0.39 0.42 0.014 0.015 0.016 f (1) 0.57 0.022 g 0.80 1.00 1.20 0.031 0.040 0.047 g1 25.75 26.00 26.25 1.014 1.023 1.033 h (2) 28.90 29.23 29.30 1.139 1.150 1.153 h1 17.00 0.669 h2 12.80 0.503 h3 0.80 0.031 l (2) 22.07 22.47 22.87 0.869 0.884 0.904 l1 18.57 18.97 19.37 0.731 0.747 0.762 l2 (2) 15.50 15.70 15.90 0.610 0.618 0.626 l3 7.70 7.85 7.95 0.303 0.309 0.313 l4 5 0.197 l5 3.5 0.138 m 3.70 4.00 4.30 0.145 0.157 0.169 m1 3.60 4.00 4.40 0.142 0.157 0.173 n 2.20 0.086 o 2 0.079 r 1.70 0.067 r1 0.5 0.02 r2 0.3 0.12 r3 1.25 0.049 r4 0.50 0.019 v5? (typ.) v1 3? (typ.) v2 20? (typ.) v3 45? (typ.) (1): dam-bar protusion not included (2): molding protusion included flexiwatt27 (vertical) h3 r4 g v v g1 l2 h1 h f m1 l flex27me v3 o l3 l4 h2 r3 n v2 r r2 r2 c b l1 m r1 l5 r1 r1 e d a v1 v1 7139011 pin 1
TDA7563B package information doc id 12733 rev 3 31/33 figure 34. powerso36 (slug up) mechanical data and package dimensions outline and mechanical data dim. mm inch min. typ. max. min. typ. max. a 3.270 - 3.410 0.1287 - 0.1343 a2 3.100 - 3.180 0.1220 - 0.1252 a4 0.800 - 1.000 0.0315 - 0.0394 a5 - 0.200 - - 0.0079 - a1 0.030 - -0.040 0.0012 - -0.0016 b 0.220 - 0.380 0.0087 - 0.0150 c 0.230 - 0.320 0.0091 - 0.0126 d 15.800 - 16.000 0.6220 - 0.6299 d1 9.400 - 9.800 0.3701 - 0.3858 d2 - 1.000 - - 0.0394 - e 13.900 - 14.500 0.5472 - 0.5709 e1 10.900 - 11.100 0.4291 - 0.4370 e2 - - 2.900 - - 0.1142 e3 5.800 - 6.200 0.2283 - 0.2441 e4 2.900 - 3.200 0.1142 - 0.1260 e - 0.650 - - 0.0256 - e3 - 11.050 - - 0.4350 - g 0 - 0.075 0 - 0.0031 h 15.500 - 15.900 0.6102 - 0.6260 h - - 1.100 - - 0.0433 l 0.800 - 1.100 0.0315 - 0.0433 n - - 10? - - 10? s - -8?- -8? (1) ?d and e1? do not include mold flash or protusions. mold flash or protusions shall not exceed 0.15mm (0.006?). (2) no intrusion allowed inwards the leads. powerso36 (slug up) 7183931 g
revision history TDA7563B 32/33 doc id 12733 rev 3 11 revision history table 12. document revision history date revision changes 05-oct-2006 1 initial release. 19-dec-2007 2 updated ta b l e 3 : t h e r m a l d a t a . 14-dec-2009 3 updated figure 34: powerso36 (slug up) mechanical data and package dimensions on page 31 .
TDA7563B doc id 12733 rev 3 33/33 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2009 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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